Description:
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. These Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity.
Packaging:
Features:
Diameter | 0.40mm |
Tolerance | ±10um |
Some products sold through this website can expose you to chemicals including diisononyl Phthalate (DINP), which is known to the State of California to cause cancer (www.P65warnings.ca.gov).
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